Development tailored to needs: Vacuum lamination equipment and ACF bonding equipment.
Leveraging the unique technology and expertise of a semiconductor device manufacturer, we achieve high quality and productivity!
Omiya Engineering provides support for product development, such as modularizing devices developed by our customers. We have our own original vacuum lamination equipment and ACF bonding equipment, which can be customized. We are capable of one-stop solutions not only for development but also for mass production processes. Utilizing the unique technology and expertise of a semiconductor equipment manufacturer, we achieve high quality and productivity. Please feel free to contact us when needed. 【Features】 ■ We have our own original ACF bonding equipment and can accommodate customization. ■ We manufacture the jigs necessary for prototype development. ■ We offer detailed development and proposals tailored to customer requests. ■ We can provide one-stop solutions not only for development but also for mass production processes. *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：大宮工業 営業本部営業課
- 価格：Other
